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Freescale Semiconductor Technical Data
MPX5100 Rev 11, 4/2008
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated, and Calibrated
The MPX5100 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Features * * * * * * 2.5% Maximum Error over 0 to 85C Ideally suited for Microprocessor or Microcontroller-Based Systems Patented Silicon Shear Stress Strain Gauge Available in Absolute, Differential and Gauge Configurations Durable Epoxy Unibody Element Easy-to-Use Chip Carrier Option
MPX5100/MPXV5100 SERIES
INTEGRATED PRESSURE SENSOR 0 to 100 kpa (0 to 14.5 psi) 15 to 115 kPa (2.2 to 16.7 psi) 0.2 to 4.7 V Output SMALL OUTLINE PACKAGES
MPXV5100GC6U CASE 482A-01
MPXV5100GC7U CASE 482C-03
Typical Applications * * * * Patient Monitoring Process Control Pump/Motor Control Pressure Switching ORDERING INFORMATION
Device Type Options Case No. 867 867 867C 867B 867B 867F 482A 482C 1351 1369 MPX Series Order Device Marking Number MPX5100A MPX5100D MPX5100DP MPX5100AP MPX5100GP MPX5100GSX MPXV5100GC6U MPX5V100GC7U MPXV5100DP MPXV5100GP MPX5100A MPX5100D MPX5100DP MPX5100AP MPX5100GP MPX5100D MPXV5100G MPXV5100G MPXV5100 MPXV5100G 1 2 3 MPXV5100DP CASE 1351-01 MPXV5100GP CASE 1369-01
PIN NUMBER(1)
1 2 3 4 N/C VS GND VOUT 5 6 7 8 N/C N/C N/C N/C
UNIBODY PACKAGE (MPX5100 SERIES) Basic Absolute Elements Differential Ported Differential Dual Ports Elements Absolute, Single Port Gauge, Single Port Gauge, Axial PC Mount Gauge, Axial Port, SMT Gauge, Axial Port, DIP Gauge, Dual Port, SMT Gauge, Side Port, SMT
1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin1 is noted by the notch in the lead.
PIN NUMBER(1)
VOUT GND VS 4 5 6 N/C N/C N/C
1. Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.
UNIBODY PACKAGES
MPX5100A/D CASE 867-08 MPX5100GSX CASE 867F-03
MPX5100AP/GP CASE 867B-04
MPX5100DP CASE 867C-05
(c) Freescale Semiconductor, Inc., 2005-2008. All rights reserved.
VS
Sensing Element
Thin Film Temperature Compensation and Gain Stage # 1
Gain Stage # 2 and Ground Reference Shift Circuitry
VOUT
GND
Pins 1 and 5 through 8 are NO CONNECTS for small outline packages Pins 4, 5, and 6 are NO CONNECTS for unibody packages
Figure 1. Fully Integrated Pressure Sensor Schematic TABLE 1. Maximum Ratings(1)
Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol PMAX TSTG TA Value 400 -40 to +125C -40 to +125C Unit kPa C C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
TABLE 2. Operating Characteristics (VS = 5.0 VDC, TA = 25C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4 required to meet electrical specifications.)
Characteristic Pressure Range Gauge, Differential: MPX5100D/MPX5100G/MPXV5100G Absolute: MPX5100A Supply Voltage(2) Supply Current Minimum Pressure @ VS = 5.0 V Offset(3) (0 to 85C) Differential and Absolute (0 to 85C) Differential and Absolute (0 to 85C)
(1)
Symbol POP
Min 0 15 4.75 -- 0.088 4.587 -- -- -- -- -- -- --
Typ -- -- 5.0 7.0 0.20 4.700 4.500 -- 45 1.0 0.1 20 0.5
Max 100 115 5.25 10 0.313 4.813 -- 2.5 -- -- -- -- --
Unit kPa
VS IO VOFF VFSO VFSS -- V/P tR IO+ -- --
VDC mAdc VDC VDC VDC %VFSS mV/kPa ms mAdc ms %VFSS
Full Scale Output(4) @ VS = 5.0 V Full Scale Span(5) @ VS = 5.0 V Accuracy(6) Sensitivity Response Time(7)
Output Source Current at Full Scale Output Warm-Up Time(8) Offset Stability 1. 2. 3. 4. 5.
(9)
1 kPa (kiloPascal) equals 0.145 psi. Device is ratiometric within this specified excitation range. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25C. * TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum pressure applied over the temperature range of 0 to 85C, relative to 25C. * Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25C.
MPX5100 2 Sensors Freescale Semiconductor
7. Response Time is defined as the time for the incremental changed in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-Up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0x to 85xC using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range. Figure 3 illustrates both the Differential/Gauge and the Absolute Sensing Chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX5100 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application.
Stainless Steel Metal Cover Epoxy Plastic Case 5 4 Output Voltage (V) 3 2 1 0
Span Range (Typ) 100 110 90 Epoxy Plastic Case Die Bond
Vout = VS*(0.009*P+0.04) (Pressure Error * Temperature Factor * 0.009 * VS VS = 5.0 V 0.25 Vdc PE = 2.5 TM = 1 TEMP = 0 to 85C
MAX TYP MIN 10 20 30 40 50 60 70 80
0
Pressure (kPa)
(Typ) Offset
Figure 2. Output Vs. Pressure Differential
Fluorosilicone Gel Die Coat Wire Bond
Fluorosilicone Gel Die Coat Wire Bond
Die
Die
Stainless Steel Metal Cover
Lead Frame
Die Bond Differential/Gauge Element
Lead Frame
Absolute Element
Figure 3. Cross Sectional Diagrams (Not to Scale) Figure 4 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended.
+5.0 V
VOUT Vs IPS 1.0 F 0.01 F GND
OUTPUT
470 pF
Figure 4. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646.)
MPX5100 Sensors Freescale Semiconductor 3
Output Range (Typ)
Transfer Function (MPX5100D, MPX5100G, MPXV5100G Nominal Transfer Value: VOUT = VS (P x 0.009 + 0.04)
(Pressure Error x Temp. Mult. x 0.009 x VS) VS = 5.0 V 5% P kPa
Temperature Error Multiplier MPX5100D/MPX5100G/MPXV5100G Series
Break Points 4.0 3.0 2.0 1.0 0.0 -40 -20 0 20 40 60 Temperature in C 80 100 120 140 Temp - 40 0 to 85C +125 Multiplier 3 1 3
Note: The Temperature Multiplier is a linear response from 0 to -40C and from 85 to 125C.
Pressure Error Band
3.0 2.0 Error (kPa) 1.0 0.0 -1.0 -2.0 -3.0
MPX5100D/MPX5100G/MPXV5100G Series
Error Limits for Pressure
0
20
40
60
80
100
120
Pressure in kPa
Pressure 0 to 100 kPa
Error (max) 2.5 kPa
MPX5100 4 Sensors Freescale Semiconductor
Transfer Function (MPX5100A) Nominal Transfer Value: VOUT = VS (P x 0.009 + 0.095)
(Pressure Error x Temp. Mult. x 0.009 x VS) VS = 5.0 V 5% P kPa
Temperature Error Multiplier MPX5100A Series
Break Points Temp Multiplier - 40 0 to 85C +125 3 1 3
4.0 3.0 2.0 1.0 0.0 -40 -20 0
20
40
60
80
100
120
130
140
Temperature in C Note: The Temperature Multiplier is a linear response from 0 to -40C and from 85 to 125C.
Pressure Error Band MPX5100A Series
3.0 2.0 Error (kPa) 1.0 0.0 -1.0 -2.0 -3.0 Pressure 15 to 115 kPa Error (max) 2.5 kPa 0 20 40 60 80 100 130 Pressure in kPa Error Limits for Pressure
MPX5100 Sensors Freescale Semiconductor 5
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluoro silicone gel which protects the die from harsh media. The MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using Table 3 below.
TABLE 3. PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Part Number MPX5100A, MPX5100D MPX5100DP MPX5100AP, MPX5100GP MPX5100GSX MPXV5100GC6U MPXV5100GC7U MPXV5100DP MPXV5100GP Case Type 867 867C 867B 867F 482A 482C 1351 1369 Pressure (P1) Side Identifier Stainless Steel Cap Side with Part Marking Side with Port Attached Side with Port Attached Side with Port Attached Side with Port Attached Side with Part Marking Side with Port Attached
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total footprint, the packages will self align when subjected to a design. The footprint for the surface mount packages must be solder reflow process. It is always recommended to design the correct size to ensure proper solder connection interface boards with a solder mask layer to avoid bridging and between the board and the package. With the correct shorting between solder
Figure 5. Small Outline Package Footprint
MPX5100 6 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
-A4 5
D
8 PL
0.25 (0.010)
M
TB
S
A
S
N
-BG
8 1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17
S
W
V C H J K M
PIN 1 IDENTIFIER
-TSEATING PLANE
DIM A B C D G H J K M N S V W
CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE
-A4 5
N
-BG
8 1
0.25 (0.010)
M
TB
D 8 PL S A
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL.
S DIM A B C D G J K M N S V W SEATING PLANE INCHES MILLIMETERS MAX MAX MIN MIN 10.79 0.425 10.54 0.415 10.79 0.425 10.54 0.415 13.21 0.520 12.70 0.500 0.864 0.66 0.034 0.026 0.100 BSC 2.54 BSC 0.28 0.23 0.011 0.009 3.05 2.54 0.120 0.100 15 0 15 0 11.38 0.448 11.28 0.444 14.22 0.560 13.72 0.540 6.48 6.22 0.255 0.245 3.17 2.92 0.125 0.115
DETAIL X S W
V C
PIN 1 IDENTIFIER
-TK M J DETAIL X
CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE
MPX5100 Sensors Freescale Semiconductor 7
PACKAGE DIMENSIONS
C R M B -AN
PIN 1 SEATING PLANE
1 2 3 4 5 6
POSITIVE PRESSURE (P1)
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630).
INCHES MILLIMETERS MAX MIN MAX MIN 16.00 0.595 0.630 15.11 13.56 0.514 0.534 13.06 5.59 0.200 0.220 5.08 0.84 0.027 0.033 0.68 1.63 0.048 0.064 1.22 0.100 BSC 2.54 BSC 0.40 0.014 0.016 0.36 18.42 0.695 0.725 17.65 30 NOM 30 NOM 12.57 0.475 0.495 12.07 11.43 0.430 0.450 10.92 0.090 0.105 2.29 2.66
L
-TG F D 6 PL 0.136 (0.005)
M
J S
TA
M
DIM A B C D F G J L M N R S OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN
STYLE 1: PIN 1. 2. 3. 4. 5. 6.
VOUT GROUND VCC V1 V2 VEX
STYLE 2: PIN 1. 2. 3. 4. 5. 6.
OPEN GROUND -VOUT VSUPPLY +VOUT OPEN
STYLE 3: PIN 1. 2. 3. 4. 5. 6.
CASE 867-08 ISSUE N UNIBODY PACKAGE
MPX5100 8 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 867B-04 ISSUE G UNIBODY PACKAGE
MPX5100 Sensors Freescale Semiconductor 9
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 867B-04 ISSUE G UNIBODY PACKAGE
MPX5100 10 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH.
INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.182 0.194 0.310 0.330 0.248 0.278 MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 4.62 4.93 7.87 8.38 6.30 7.06
P 0.25 (0.010) X R
PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2)
M
TQ
M
-AU W L V
PORT #2 VACUUM (P2)
N
PORT #1 POSITIVE PRESSURE (P1)
-QB
PIN 1
1
2
3
4
5
6
K S
C
SEATING PLANE
DIM A B C D F G J K L N P Q R S U V W X
-T-
-TJ
SEATING PLANE
G F
D 6 PL 0.13 (0.005)
M
A
M
STYLE 1: PIN 1. 2. 3. 4. 5. 6.
VOUT GROUND VCC V1 V2 VEX
CASE 867C-05 ISSUE F UNIBODY PACKAGE
-TC E A U -Q-
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MAX MIN MIN MAX 28.45 27.43 1.080 1.120 19.30 18.80 0.740 0.760 16.51 16.00 0.630 0.650 0.84 0.68 0.027 0.033 4.57 4.06 0.160 0.180 1.63 1.22 0.048 0.064 0.100 BSC 2.54 BSC 0.41 0.36 0.014 0.016 6.10 5.59 0.220 0.240 2.03 1.78 0.070 0.080 4.06 3.81 0.150 0.160 4.06 3.81 0.150 0.160 11.68 11.18 0.440 0.460 18.42 17.65 0.695 0.725 21.84 21.34 0.840 0.860 4.93 4.62 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. 5. 6.
V
N B R
PORT #1 POSITIVE PRESSURE (P1)
PIN 1
-P0.25 (0.010)
M
TQ
M
6
5
4
3
2
1
S K J 0.13 (0.005)
M
TP
S
D 6 PL QS F
G
VOUT GROUND VCC V1 V2 VEX
CASE 867F-03 ISSUE D UNIBODY PACKAGE
MPX5100 Sensors Freescale Semiconductor 11
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE
MPX5100 12 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
-TC E A U -Q-
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MAX MIN MIN MAX 28.45 27.43 1.080 1.120 19.30 18.80 0.740 0.760 16.51 16.00 0.630 0.650 0.84 0.68 0.027 0.033 4.57 4.06 0.160 0.180 1.63 1.22 0.048 0.064 0.100 BSC 2.54 BSC 0.41 0.36 0.014 0.016 6.10 5.59 0.220 0.240 2.03 1.78 0.070 0.080 4.06 3.81 0.150 0.160 4.06 3.81 0.150 0.160 11.68 11.18 0.440 0.460 18.42 17.65 0.695 0.725 21.84 21.34 0.840 0.860 4.93 4.62 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. 5. 6.
V
N B R
PORT #1 POSITIVE PRESSURE (P1)
PIN 1
-P0.25 (0.010)
M
TQ
M
6
5
4
3
2
1
S K J 0.13 (0.005)
M
TP
S
D 6 PL QS F
G
VOUT GROUND VCC V1 V2 VEX
CASE 867F-03 ISSUE D CASE 1351-01 UNIBODY PACKAGE ISSUE A SMALL OUTLINE PACKAGE
PAGE 2 OF 2
MPX5100 Sensors Freescale Semiconductor 13
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE
MPX5100 14 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
-TC E A U -Q-
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MAX MIN MIN MAX 28.45 27.43 1.080 1.120 19.30 18.80 0.740 0.760 16.51 16.00 0.630 0.650 0.84 0.68 0.027 0.033 4.57 4.06 0.160 0.180 1.63 1.22 0.048 0.064 0.100 BSC 2.54 BSC 0.41 0.36 0.014 0.016 6.10 5.59 0.220 0.240 2.03 1.78 0.070 0.080 4.06 3.81 0.150 0.160 4.06 3.81 0.150 0.160 11.68 11.18 0.440 0.460 18.42 17.65 0.695 0.725 21.84 21.34 0.840 0.860 4.93 4.62 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. 5. 6.
V
N B R
PORT #1 POSITIVE PRESSURE (P1)
PIN 1
-P0.25 (0.010)
M
TQ
M
6
5
4
3
2
1
S K J 0.13 (0.005)
M
TP
S
D 6 PL QS F
G
VOUT GROUND VCC V1 V2 VEX
CASE 867F-03 ISSUE D CASE 1369-01 UNIBODY PACKAGE ISSUE B SMALL OUTLINE PACKAGE
PAGE 2 OF 2
MPX5100 Sensors Freescale Semiconductor 15
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MPX5100 Rev. 11 04/2008

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